In response to the Intel slide, AMD have stated they have no plans to ditch sockets: http://news.softpedia.com/news/AMD-W...t-312105.shtml
In response to the Intel slide, AMD have stated they have no plans to ditch sockets: http://news.softpedia.com/news/AMD-W...t-312105.shtml
I wonder why they chose that path? Maybe the die shrink really helps and they don't want to play all their cards? Refining SR/Ex on the node should help show it in a better light when it's out. I just hope they crack on with the Richland release; no updates until Q2 2014 would be catastrophic. Fair enough if they're not overly enthusiastic about AM3+ but they need to remain competitive on more than price for mainstream.
Is it me or has AMD finally got some more proactive marketeers?? At least that is one positive thing!!
I'm very tired now so might be missing the point, but what's in those links? About Kabini taping out?
Mention of something called GNB Core.
"GNB core is based on the AMD fusion core technology, The GNB is a fusion of Graphic processor, power optimizer, audio processor, south bridge and north bridge which share a common interface with system memory."
Also,I just noticed the FX4300 only has 4MB L3 cache. That might explain its performance.
GNB core doesn't seem to include any CPU technology. EITHER, it's a modular component of future APUs that you can bolt on a set of cores to produce a full SoC, or it's a single chip replacement for a conventional chipset that you couple of a "discrete" CPU. Interestingly, if it's the latter, it'd be a CPU without IMC, which seems unlikely, so it's probably a module for future APUs - although it seems odd that they'd decouple graphics elements from existing x86 APUs ... could be an indication of a move towards an ARM-based SoC perhaps?
Lordy I love a bit of wild speculation on a Monday morning
Maybe it's something to do with interposers? Having everything on the same interposer but separate dies could help massively with yield considering how much stuff is being added to the CPU die now, along with larger GPU cores and possibly memory?
Think too much is being read into this. When we see "core" we think "cpu core", but this sounds like "northbridge core" to me. Graphic North Bridge perhaps?
Separating the graphics core from the CPU cores doesn't make much sense though, considering AMD's long-term plans. IGP on northbridge is how things were done on 775/AMx.
It could be down to them making ARM based SOCs. So have one block of the SOC being the GNB,another being the memory controller and the other being the CPU cores.
I can see some inherent benefit to integrating audio and southbridge functions into one block, but I don't get where the graphics and, partilcularly, northbridge parts fit that. AFAIK if you take memory controller, graphics and PCIe lane management out of a northbridge, which AMD already have, you end up with not much left over! So I'm not sure why you'd modularise all that functionality, just to combine it back together then stack on a southbridge and an audio chip. Unless, of course, you wanted to go down the SoC route but not limit yourself to just x86 or ARM cores, but have the option to do either/both. So you end up with a common "uncore", coupled with an IMC and your choice of ARM or x86 cores.
Having a project team look specifically at how you combine several uncore modules into a functional block would make sense then...
It looks the spat between AMD and Intel over Seamicro has still not ended:
http://www.tomshardware.com/news/amd...ver,19701.html
For those who don't remember it,it started here:
http://www.pcmag.com/article2/0,2817,2401344,00.asp
Roy Taylor appointed head of AMD worldwide channel sales:
http://www.kitguru.net/components/gr...channel-sales/
The chap was responsible for TWIMTBP:
http://www.linkedin.com/in/roytaylor
Some better sales/marketing is arguably what AMD needs!
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