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    Go Back   HEXUS.community discussion forums > HEXUS.channels > HEXUS.events > APAC > Intel Developer Forum Spring 2008, Shanghai

    Intel Developer Forum Spring 2008, Shanghai All the news as team.HEXUS attend the Intel Developer Forum over in Shanghai, China.

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    Old 02-04-2008, 08:12 AM   #1 (permalink)
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    Intel Calpella mobile platform is Centrino 3, perhaps

    Features 45nm Nehalem processor, energy-efficient WiFi adapter, and new graphics. Out in 2009.
    Read more.
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    Old 07-04-2008, 01:24 PM   #2 (permalink)
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    Re: Intel Calpella mobile platform is Centrino 3, perhaps

    Intel reckons that the new adapter will reduce under-load power requirements by a factor of 3x.
    There does always seem to be a lingering issue in the back of my mind, when I hear of power reduction. Even as CPU/Chipset usage -> 0, the whole system's usage, doesn't, surely, as you still have to power the laptop's screen.

    There are, of course, alternatives to LCD coming out in the next few years, but they will still need "some" power.

    MC2

    ("My System": PC & Next PC)
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