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On DFI's X38, P35 and RD790 boards, the area at the back where the Karajan audio module would typically reside is being used for DFI's new patent-pending heat-pipe cooling solution.
This should result in much cooler temperatures on the northbridge and southbridge, the VRMs and other components as well.
Find out more in this COMPUTEX 2007 headline.
Those boards look pretty interesting.
3xPCI and 4xPCI-E would be quite handy in my media box, along with the multiple SATA ports on the lower edge. hmmmm....
Heat pipes could be interesting too, my box is currently completely passively cooled.
I am fairly certain it will not be 100% passively cooled, given the expected heat of the new chipsets like X38, and the fact that these boards are meant for serious overclocking. I am guessing they will have little exhaust fan/s on heatsinks attached to pipes from the chipsets.