Researchers demo intrachip microchannel cooling system

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Coolant flows in microchannels between layered processors to cool >1kW per sq cm.

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Nice. Now we just need intel to artificially hamstring the chips using this tech by doing the fluid equivalent of not soldering the lids and we can look forward to getting 25% of the benefit.

I wonder if you can integrate the whole phase change system under a heatspreader? Easier to install a chip like that (with a normal heatsink/waterblock taking the heat from the heatspreader) than messing around with piping (although the HFE-7100 doesn't seem to be too hard to work with)

The only reason I can think of for DARPA wanting this is to advance terminator technology !