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OC expert der8auer finds his DeLid Die Mate 2 does the job (with a small modification).
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Read more.Quote:
OC expert der8auer finds his DeLid Die Mate 2 does the job (with a small modification).
Gamersnexus did similar tests on a Ryzen 3 2200G:
https://www.youtube.com/watch?v=7o1ITMw-O2o
https://www.youtube.com/watch?v=CD384Aem1kc
https://www.gamersnexus.net/guides/3...d-liquid-metal
shame those de-lidding tools are so expensive
For those with access to a 3D printer, there are a bunch of design on Thingiverse for de-lidding CPUs.
For instance this 'conventional' looking one:
https://i.imgur.com/rJEZoz1.png
https://www.thingiverse.com/thing:1630652
Or this rather different looking one
https://i.imgur.com/fDmr2dS.png
https://www.thingiverse.com/thing:1209396
Does anyone have a delidding tool they can lend out? I've got a 7700K dying to be delidded!
TBH,considering the limited CPU core overclocking of these APUs,I am not sure whether delidding them is worth the hassle.
They do have toothpaste TIM though, CAT, to cut cost (as AMD freely admits).
I ~never see compressed air discussed as an over the top, precisely directed cooling method.
It has its good points.
easily piped to multiple heat spots
a water jacket on the head of the compression cylinder makes an easy heat exchanger, resulting in freezing hi pressure air at the tube nozzle.
no scary liquids in case, or need to circulate liquids in BOTH directions - it just blasts chilled air INTO the case, only a little, but precisely.
multiple tubes to one hot spot are fine, & indeed desirable, as they can be opposing for greater effect.
So for example, an improv ~water jacket on the head of a cheap 12v automotive tire pump (out on the window ledge :)), with compressed air widely distributed & precisely directed (aquarium aeration tubes & fittings?) nozzles directed into the processor heatsink fins, could be a valuable supplement to existing air cooling.
NVME drives could get a tube each. The chipset heat sink, memory ...
PS re improv water jacket -if the pump has no sump, it could operate "upside down", & the head could be immersed in a cooling cistern (clue :)) of water.
Interesting concept, but the problem is with providing the cold air. You mention freezing high pressure air, but you need some means of cooling the air to that low temperature, which implies some form of external refridgeraton unit. unless you are going to compress the air itself, then cool it back to ambient temperature (externally) and rely on adiabatic expansion at the nozzle to provide the cooling effect. Either method would require some cumbersome external equipment.
One method of cooling might be an external peltier device, but the outputs of thos are quite low, and you would probably need quite a high air flow so the cooling effect would be small.
Directed cool air is probably OK for a one off experimental set up, but ot for mainstream builders.
Of course cold air is used (air conditioning) in server farms, and I have seen computer cooled using chilled water piper to heat exchangers in server farms, but that is a different scale and relies on a chilled water plant with quite a high output.
Forget the external water/air coolers and peltiers, take compressed refrigerant straight to the CPU!
Remember that strange period some years ago when there were a few phase change cooling products available in retail?
It appears the TIM used is decent quality:
https://www.reddit.com/r/Amd/comment...ryzen_g_2400g/
Standard intercooler like on a car turbo using a pair or radiators would work.
Still, I have yet to see an air compressor that wasn't damned noisy, and in the end it is just air cooling and unless you can get sub zero temperatures out if it a system will have difficulty competing with cheap fans or water blocks.
Air compressors are also quite pricey (especially if you want decent airflow), and sub-ambient cooling brings the possibility of issues with condensation.
Also, if you've got enough of a pressure drop for significant cooling across the nozzle, I could see that being annoyingly loud. Like one of these:
https://images-eu.ssl-images-amazon....1Ag7LP1x9L.jpg
Fast moving air is also a great generator of static electricity :)
I'm highly skeptical of those results, the small amount of research I've done seem to point towards AMD using TC-5022 or similar Dow Corning silicon grease, they're no where even close to Kryonaut or Conductonaut level of thermal conductivity, what they're probably seeing is the result of lowering the Z height.
https://i.imgur.com/r3i6kpp.png
AMD stuff seems to be decent:
http://www.tomshardware.com/reviews/...n,5108-11.html
Also I am not sure what Z height has to do with it,since they are re-using the IHS,ie,its not a direct die cooling solution they are using.
From my own experience of using several types of non-conductive thermal compounds in a SFF system,most of the decentish stuff is more or less the same,and if anything the spreadibility of the compound seems to make much more difference. Its most likely all of these formulations are made by a few largish OEMs anyway,and just put into fancy tubes for the parts companies.
Plus I wouldn't touch the liquid metal formulations with a barge pole as they can actually attack certain metals themselves.
Even then I am not sure why you would bother with the APUs anyway - its not like they can overclock that well and the only reason people care for the Intel K CPUs,is since they do overclock well,and the thermal compound seems to more an issue in that case,if you want that extra 100MHZ.