Read more.And it previews a hybrid 10nm Lakefield CPU architecture with Foveros 3D packaging.
Read more.And it previews a hybrid 10nm Lakefield CPU architecture with Foveros 3D packaging.
Incredible Performance!
Will wait for numbers then
One thing that is worrying about their chatting of 10nm is the large amount of "stellar for mobile", "great for battery life" and "low power for better mobile performance".
Hopefully this isn't foreboding...
Yeah, there have been rumours (not that they are worth anything) that Intel's 10nm, the current version they are working on, has issues with high clock speeds.
So I can see why they would be targeting lower power devices this year with the process, as that may be the process's sweet spot, until Intel work out the performance issue (maybe they have already).
HVM today for Q4 2019 release sounds fishy to me as well.
"Rooted in human understanding"?! What utter tripe is this?
Interesting, good to see some official announcement on 10nm at least though. Sounds like its going to be another 12-14 months until i'll be able to buy one though which is a bit of a shame - looks like i'll be sticking with my 6700K for another year then!
oh how long I have been waiting for ice lake. ill give Intel this final year, if I don't see and able to buy ice lake before year end, ill consider something else, and it wont be INTEL. GET ON WITH 10th Gen 10nm already INTEL
Are we therefore to expect another fast approacing socket change?
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