Intel reveals three new chip packaging technologies

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At SEMICON West the firm discusses Co-EMIB, ODI, and MDIO advanced packaging.

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So basically MDIO AMDs chiplet architecture? But instead of Infinity Fabric is a another universal bus interface.

I'd like to see when Intel is actually going to make due on these fancy pantsing they're doing.

Bring back Slot 1!!

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Don't mention the glue

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I had to laugh at that part. Considering Intel criticised AMD for their chiplet design using Infinity Fabric, how is this different?

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Originally Posted by Iota

I had to laugh at that part. Considering Intel criticised AMD for their chiplet design using Infinity Fabric, how is this different?

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Intel use magic pixie glue, that's different and allowed :)

This stuff has been going back and forth since Intel put a pair of Pentium 4 die passively wired into the same package to call it a dual core, which oddly didn't suck as hard as it should have.