Results 1 to 5 of 5

Thread: Intel reveals three new chip packaging technologies

  1. #1
    HEXUS.admin
    Join Date
    Apr 2005
    Posts
    28,924
    Thanks
    0
    Thanked
    1,865 times in 638 posts

    Intel reveals three new chip packaging technologies

    At SEMICON West the firm discusses Co-EMIB, ODI, and MDIO advanced packaging.
    Read more.

  2. #2
    Senior Member
    Join Date
    May 2014
    Posts
    1,465
    Thanks
    89
    Thanked
    196 times in 140 posts

    Re: Intel reveals three new chip packaging technologies

    So basically MDIO AMDs chiplet architecture? But instead of Infinity Fabric is a another universal bus interface.

    I'd like to see when Intel is actually going to make due on these fancy pantsing they're doing.

  3. #3
    Senior Member kalniel's Avatar
    Join Date
    Aug 2005
    Posts
    29,196
    Thanks
    1,520
    Thanked
    2,933 times in 2,376 posts
    • kalniel's system
      • Motherboard:
      • Gigabyte X58A UD3R rev 2
      • CPU:
      • Intel Xeon X5680
      • Memory:
      • 12gb DDR3 2000
      • Graphics card(s):
      • nVidia GTX 1060 6GB
      • PSU:
      • Seasonic 600W
      • Case:
      • Cooler Master HAF 912
      • Operating System:
      • Win 10 Pro x64
      • Monitor(s):
      • Dell U2311H
      • Internet:
      • O2 8mbps

    Re: Intel reveals three new chip packaging technologies

    Bring back Slot 1!!

  4. #4
    Senior Member
    Join Date
    May 2009
    Location
    Where you are not
    Posts
    657
    Thanks
    258
    Thanked
    53 times in 42 posts
    • Iota's system
      • Motherboard:
      • Asus Maximus Hero XI
      • CPU:
      • Intel Core i7 9700K
      • Memory:
      • CMD32GX4M2C3200C16
      • Storage:
      • 1 x 250GB / 1 x 1TB Samsung 970 Evo Plus NVMe
      • Graphics card(s):
      • Nvidia RTX 2080 FE
      • PSU:
      • Corsair HXi 850
      • Case:
      • Lian Li PC-X500B
      • Operating System:
      • Windows 10 Pro 64-bit
      • Monitor(s):
      • Dell S2716DG
      • Internet:
      • 40Mbps SKY Fibre

    Re: Intel reveals three new chip packaging technologies

    Don't mention the glue
    I had to laugh at that part. Considering Intel criticised AMD for their chiplet design using Infinity Fabric, how is this different?

  5. #5
    root Member DanceswithUnix's Avatar
    Join Date
    Jan 2006
    Location
    In the middle of a core dump
    Posts
    10,115
    Thanks
    504
    Thanked
    1,044 times in 888 posts
    • DanceswithUnix's system
      • Motherboard:
      • Asus X470-PRO
      • CPU:
      • 3700X
      • Memory:
      • 16GB 3200MHz
      • Storage:
      • 1TB Linux, 1TB Games (Win 10)
      • Graphics card(s):
      • Asus Strix RX Vega 56
      • PSU:
      • 650W Corsair TX
      • Case:
      • Antec 300
      • Operating System:
      • Fedora 30 + Win 10 Pro 64 (yuk)
      • Monitor(s):
      • Benq XL2730Z 1440p + Samsung 2343BW 2048x1152
      • Internet:
      • Zen 80Mb/20Mb VDSL

    Re: Intel reveals three new chip packaging technologies

    Quote Originally Posted by Iota View Post
    I had to laugh at that part. Considering Intel criticised AMD for their chiplet design using Infinity Fabric, how is this different?
    Intel use magic pixie glue, that's different and allowed

    This stuff has been going back and forth since Intel put a pair of Pentium 4 die passively wired into the same package to call it a dual core, which oddly didn't suck as hard as it should have.

Thread Information

Users Browsing this Thread

There are currently 1 users browsing this thread. (0 members and 1 guests)

Posting Permissions

  • You may not post new threads
  • You may not post replies
  • You may not post attachments
  • You may not edit your posts
  •