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Thread: Intel reveals three new chip packaging technologies

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    Intel reveals three new chip packaging technologies

    At SEMICON West the firm discusses Co-EMIB, ODI, and MDIO advanced packaging.
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    Re: Intel reveals three new chip packaging technologies

    So basically MDIO AMDs chiplet architecture? But instead of Infinity Fabric is a another universal bus interface.

    I'd like to see when Intel is actually going to make due on these fancy pantsing they're doing.

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    Banhammer in peace PeterB kalniel's Avatar
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    Re: Intel reveals three new chip packaging technologies

    Bring back Slot 1!!

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    Re: Intel reveals three new chip packaging technologies

    Don't mention the glue
    I had to laugh at that part. Considering Intel criticised AMD for their chiplet design using Infinity Fabric, how is this different?

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    Re: Intel reveals three new chip packaging technologies

    Quote Originally Posted by Iota View Post
    I had to laugh at that part. Considering Intel criticised AMD for their chiplet design using Infinity Fabric, how is this different?
    Intel use magic pixie glue, that's different and allowed

    This stuff has been going back and forth since Intel put a pair of Pentium 4 die passively wired into the same package to call it a dual core, which oddly didn't suck as hard as it should have.

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