Intel reveals three new chip packaging technologies

[HEXUS]

At SEMICON West the firm discusses Co-EMIB, ODI, and MDIO advanced packaging.

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[Tabbykatze]

So basically MDIO AMDs chiplet architecture? But instead of Infinity Fabric is a another universal bus interface.

I'd like to see when Intel is actually going to make due on these fancy pantsing they're doing.

[kalniel]

Bring back Slot 1!!

[Iota]

Don't mention the glue

I had to laugh at that part. Considering Intel criticised AMD for their chiplet design using Infinity Fabric, how is this different?

[DanceswithUnix]

I had to laugh at that part. Considering Intel criticised AMD for their chiplet design using Infinity Fabric, how is this different?

Intel use magic pixie glue, that's different and allowed

This stuff has been going back and forth since Intel put a pair of Pentium 4 die passively wired into the same package to call it a dual core, which oddly didn't suck as hard as it should have.