Read more.Quote:
12x12x1mm designs leverage Intel's Foveros 3D-stacking tech and intro mixed CPU cores.
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Read more.Quote:
12x12x1mm designs leverage Intel's Foveros 3D-stacking tech and intro mixed CPU cores.
So with 3D stacking, how do they cool it?
The same way the bottom of the silicon gets cooled now - its heat dissipates upwards through the rest of the chip. Silicon is by no means a perfect thermal insulator: if it was all our CPUs would burn through their substrates as soon as you turned them on...Quote:
Originally Posted by chj
Probably created to allow them to dramatically fudge figures. It seems the only way they cab come close to AMD in the foreseeable future.
Fair enough, I just thought the increase in thickness might make it harder to cool. I guess they wouldn't of gotten past the R&D stage if it was too much of a concern.
wasn't it leaked months ago? I guess with one of these ;)Quote:
Originally Posted by chj
https://img.purch.com/r/711x457/aHR0...NTc0MC5qcGc=c=
That may be why it's been delayed by a year. Intel's 10nm troubles are ongoing.Quote:
Originally Posted by chj
Scaling Foveros up to desktop levels of power may be impossible.
the easiest way would be to cool from bottom as well maybe a ceramic socket with heat pipes
At the power levels available in target devices (i.e. where you'd normally find a phone chip), who cares about cooling?