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Thread: Samsung X-Cube 3D IC packaging technology now available

  1. 13-08-2020, 12:11 PM #1
    HEXUS
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    Samsung X-Cube 3D IC packaging technology now available

    Partners can leverage the chip stacking TSV tech for "leaps in speed and power efficiency".
    Read more.
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  2. 13-08-2020, 12:19 PM #2
    Gentle Viking
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    Re: Samsung X-Cube 3D IC packaging technology now available

    SO ? Borg technology here.
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  3. 13-08-2020, 04:03 PM #3
    ohmaheid
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    Re: Samsung X-Cube 3D IC packaging technology now available

    I would've thought that Samsung actually built one of their Exynos SOC's on this X-cube process to demonstrate their capabilities and superior performance first.
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  4. 13-08-2020, 05:00 PM #4
    Tabbykatze
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    Re: Samsung X-Cube 3D IC packaging technology now available

    Quote Originally Posted by Gentle Viking View Post
    SO ? Borg technology here.
    Was about to say, HBO called, they want their cut xD
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  5. 13-08-2020, 05:33 PM #5
    3dcandy
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    Re: Samsung X-Cube 3D IC packaging technology now available

    Raspberry Pi 5?
    Old puter - still good enuff till I save some pennies!
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