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Thread: Samsung X-Cube 3D IC packaging technology now available

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    Samsung X-Cube 3D IC packaging technology now available

    Partners can leverage the chip stacking TSV tech for "leaps in speed and power efficiency".
    Read more.

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    Re: Samsung X-Cube 3D IC packaging technology now available

    SO ? Borg technology here.

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    Re: Samsung X-Cube 3D IC packaging technology now available

    I would've thought that Samsung actually built one of their Exynos SOC's on this X-cube process to demonstrate their capabilities and superior performance first.

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    Re: Samsung X-Cube 3D IC packaging technology now available

    Quote Originally Posted by Gentle Viking View Post
    SO ? Borg technology here.
    Was about to say, HBO called, they want their cut xD

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    Re: Samsung X-Cube 3D IC packaging technology now available

    Raspberry Pi 5?
    Old puter - still good enuff till I save some pennies!

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