Read more.Quote:
It is thought that the S is for 'Silent' and that these chipsets will be passively cooled.
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Read more.Quote:
It is thought that the S is for 'Silent' and that these chipsets will be passively cooled.
Seems odd to release a revised X570 chipset what with an expected change to AM5 in less than a year, assuming the revised boards aren't going to be on the market for at least a month or two and they're targeting end of year for Zen 4.
The x570 systems I’ve built over the past year were already inaudible, despite having the active chipset cooling in place on the motherboards I’d chosen... I guess this I could perhaps be a way to pander to those with “silent PC OCD” and maybe extend revenue opportunities for AMD and their partners.
I think it would be more likely that this is a refresh based around the fact that B550 seems to have more advanced features over first gen X570.
Making a whole chipset just so it's passively cooled sounds stupid, but i've been wrong many times before on what people want and what businesses will give!
I never hear the chipset fan on my X570 motherboard fan so is there really a need for a silent version?
I'd happily swap my mobo for a silent version. The fan is fairly quiet to be fair, but I'd rather have a passive version for longevity sake. That and a few more sata ports. MSI I'm looking at you there. 4 is not enough.
I guess something like that would be made even harder what with the voltage regulation being moved to the modules on DDR5.
Having said that it would be a pleasant surprise if AM4 got one last chip (Zen3+ or Zen4 like kompukare suggests), as remote a chance as that maybe.
The fan on mine doesn't kick in until the chip hits 50C.
That said, with a day spent playing with password cracking out of sheer boredeom, this room feels like it's 50C and I'm sure the PC has hovered across the floor with all of the fans blaring.
So the X570 "chipset" is really just the IO die of a 3000 series CPU, a Global Foundries 12nm part.
I presume this means the Zen 2 IO die has been shrunk or GF's process much improved?
Perhaps the Zen 2 IO die are running low, and AMD are switching to 5000 series IO die for their chipsets which I believe are really similar but have some tweaks.
I feel like I've not been keeping up here, wonder which it is.
At a guess it maybe just GF moving from 12LP to 12LP+.
Having just said that maybe not as 12LP+ apparently needs investment in redesigns...Maybe just 12LP maturing?
EDIT: Having just refreshed my memory isn't the X570 chipset the 14nm IO die from EPYC? Maybe this new X570 is the 12nm IO die from Ryzen chips.
If you need X570, surely the multitude of PCIe 4 things you have plugged in are louder than the semi-passive chipset fan? With B550 available there are few use cases where paying extra for X570 makes sense
If the next zen uses the same/compatible IF link they can package the new chiplets with the old IO die. It's more SKUs to launch, but an (unlikely) option for AMD
An epyc IO die wouldn't fit in the space available for a chipset
The mobo fan was one of the factors that pushed me to an i9/Z390 (vs 3800/X570). Had I waited for B550 and 5800 (and availability!) I'd have gone for that. A fanless X570 means it would have also entered into consideration, but the case over a B550 would need to be made.
IDK about the sizes but almost everything I've read says the X570 chipset uses the IO die from EPYC.
Wikipedia.Quote:
The die maps of the "Matisse" cIOD in particular give us fascinating insights to how AMD designed the die to serve both as a cIOD and as an external FCH (AMD X570 and TRX40 chipsets).
Ian Cutress: Twitter.Quote:
The Matisse I/O die is also used as the X570 chipset
Quote:
So for clarity:
Rome large IO die = GF 14nm
Matisse small IO die = GF 12nm
X570 Chipset = Matisse IO die on GF 14nm
That's right. The X570 chipset is the same floorplan as the Matisse IO die, but with diff chicken bits enabled/disabled. AMD has good reuse of chips
Quite.
My 3700X is a Matisse :)
Edit: I thought I remembered there being some shenanigans with 12nm vs 14nm for the CPU vs chipset, but that makes absolutely no sense in terms of manufacture where if you can use a common part then unless the numbers involved are huge and there is a big cost saving to be had, then you do common parts for flexibility. Reading some interview earlier it sounded like it is just a 12nm part. That would mean AMD could book 12nm wafers, get 12nm die, decide at the last minute whether to use them in chipsets or CPUs.
Note the TechPowerup article seems to be saying (badly) that the AM4 X570 chipset is an IO die from a 3000 series CPU, and the threadripper chipset is the IO die from a threadripper. That's how I read it, but it took a couple of goes.
Doh! I'm on a role. :)