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Thread: AMD video focuses on its 3D stacking technology

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    AMD video focuses on its 3D stacking technology

    Provides some further background info on the 3D V-Cache TSV construction process.
    Read more.

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    Senior Member Xlucine's Avatar
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    Re: AMD video focuses on its 3D stacking technology

    So did AMD design a new CCD design with TSVs squeezed into it, or have they been hiding in shipping zen 3 dies all this time?

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    Moosing about! CAT-THE-FIFTH's Avatar
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    Re: AMD video focuses on its 3D stacking technology

    Quote Originally Posted by Xlucine View Post
    So did AMD design a new CCD design with TSVs squeezed into it, or have they been hiding in shipping zen 3 dies all this time?
    IIRC,I recently saw some pictures which showed they have always been there.

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    Re: AMD video focuses on its 3D stacking technology

    Quote Originally Posted by CAT-THE-FIFTH View Post
    IIRC,I recently saw some pictures which showed they have always been there.
    https://www.reddit.com/r/AMD_Stock/c...ocated_in_the/

    That's actually really impressive that they were that confident in the tech they modified their CPUs with preliminary support and shipped an entire processor family on the offchance they'd have it ready before its life cycle ends and can double up the R&D costs without having to make custom silicon/tape outs.

    Pullout of the actual Twitter thread:
    https://twitter.com/HansDeVriesNL/st...27736199081989

    And the video:

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    Re: AMD video focuses on its 3D stacking technology

    Quote Originally Posted by Tabbykatze View Post
    That's actually really impressive that they were that confident in the tech they modified their CPUs with preliminary support and shipped an entire processor family on the offchance they'd have it ready before its life cycle ends and can double up the R&D costs without having to make custom silicon/tape outs.
    A less charitable way of looking at it would be that it's taken them 7 months longer than they initially expected to get this to work...

    If ryzen 5000 launched with the cache ice & rocket lake would have fallen a lot flatter

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    Re: AMD video focuses on its 3D stacking technology

    Quote Originally Posted by Xlucine View Post
    A less charitable way of looking at it would be that it's taken them 7 months longer than they initially expected to get this to work...

    If ryzen 5000 launched with the cache ice & rocket lake would have fallen a lot flatter
    That is very true.

    If that were the case, I wonder where the hold up was, was it with TSMC and their TSV technology or AMD for the integration. As there appears, and said, that there are no design changes for the CCD I would assume it would be either a logistical problem or a problem with cache die integration.

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