I've been intrigued with ABITs motherboard cooling solutions ever since they got the wacky idea of including fans on the I/O backplate. That changes now, however, with a move towards a silent Outside Thermal Exhaust System (OTES).
Silent OTES uses ABIT-designed heatpipe technology to transfer unwanted heat from the North Bridge to the fins of the Collection Module. From there, heat is exhausted outside of the case by air flowing from the CPU fan. The result, a totally silent platform offering excellent cooling efficiency while utilizing the existing CPU fan, ultimately providing enhanced performance, stability and a quieter experience for the end user.
This looks like a clever idea, as most CPU socket areas are designed to be cooled by the "blowoff" from a CPU HSF anyway. However, I am concerned that the grille at the back of the board might inhibit airflow through the collection module. The fins on the collection module are not packed very densely, presumably so that air can pass through them without too much resistance, so why put a restrictive grille in the way? Of course, this is just my first impression, and only testing will reveal whether or not this is actually an issue.
Nonetheless I think this could be a step in the right direction for motherboard cooling.
You can also check out ABIT's official press release.


LinkBack URL
About LinkBacks


Reply With Quote



)