Chip maker Hynix will be ramping up 60nm DDR2 chip production in the first half of 2007. The shrink from 80nm has several benefits for memory module construction, as DigiTimes reports.The resulting 1Gbit package size will allow Hynix to cost-efficiently manufacture 4GB and higher density RDIMMs (registered DIMM) and FBDIMMs (fully buffered DIMM), the company said. Planar dual-row assembly, made possible by the small package size, will eliminate the need to stack components in some modules, reducing overall manufacturing costs. Very Low profile (VLP) modules would also be enabled by the small package.