Originally Posted by
Biscuit
Hmm... doesn't seem like the manufacturers are really putting the effort in right now.
I haver to say all these VRM "Heatsinks" really boil my urine. It's surely more expensive to repeatedly design and manufacture different shaped slabs of aluminium that have a questionable performance metrics, instead of having a standard fin design that actually increases the surface area that's exposed to air flow. I can totally understand why all motherboards don't go the route of having fin and pipe designs of days gone by, as mosfet technology has moved on, but at least put something functional on the damn things.