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Thread: lapping the cpu....

  1. #33
    HEXUS.social member Agent's Avatar
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    Re: lapping the cpu....

    Quote Originally Posted by Rosaline View Post
    (*) That's all qualifications are, when all is said and done
    With the added knowledge, of course
    Quote Originally Posted by Saracen View Post
    And by trying to force me to like small pants, they've alienated me.

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    Re: lapping the cpu....

    Well my electronics teacher went to Cambridge University.

    He got the sack and is now a gardener. He was once very rude to me, and now when I drive past and see him raking up leaves in the pissing rain, I beep my horn and give him the V's. He probably doesn't even know who I am, but it feels good.

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  4. #35
    HEXUS.social member Agent's Avatar
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    Re: lapping the cpu....

    Quote Originally Posted by acrobat View Post
    Well my electronics teacher went to Cambridge University.

    He got the sack and is now a gardener. He was once very rude to me, and now when I drive past and see him raking up leaves in the pissing rain, I beep my horn and give him the V's. He probably doesn't even know who I am, but it feels good.
    I'm honestly not sure if thats a wind up or being serious
    Quote Originally Posted by Saracen View Post
    And by trying to force me to like small pants, they've alienated me.

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    The late but legendary peterb - Onward and Upward peterb's Avatar
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    Re: lapping the cpu....

    Agent is correct (and the lapping guide says this) that metal to metal contact offers the best heat transfer - however a mirror surface may not be flat - and two mirror surfaces are unlikely to be perfectly parallel so there will be voids between them. (as someone else said, the purpose of lapping is to get the surfaces flat, as well as smooth). Given that it is impossible to get the two surfaces perfectly flat (if it was, there would be no need for thermal compound) then tyhere will be a requirement for thermal compound to fill the voids.

    I would suggest that with a mirror surface it would be difficult to apply the compound thinly enough to prevent it making heat transfer worse thatn it would with a slightly rougher surface. where the tim can be squeezed into the voids.

    Again, the lapping guide that agent referenced points out that lapping to beyond the smoothness provided by 600 grit paper is unlikely to provide any worthwhile improvement.

    However I would be interested to hear of any experiments where someone has polished a heatsink and cpu to a mirror finish and mounted the two without thermal compound as theory would suggest that would give the best transfer - provided the surfaces are flat.

    Incidentally - a quick Google search brought up this brief introduction the thermal transfer:

    Heat Transfer
    Last edited by peterb; 04-11-2007 at 10:32 PM.
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    Re: lapping the cpu....

    For maximum contact area and minimal thermal resistance you'll want both parts surfaces as smooth as reasonably possible. Of course it would be practically impossible to make the surface so flat and smooth that you do not need thermal compound at all, but generally less is more.
    Quote Originally Posted by Agent View Post
    ...every time Creative bring out a new card range their advertising makes it sound like they have discovered a way to insert a thousand Chuck Norris super dwarfs in your ears...

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    Re: lapping the cpu....

    Quote Originally Posted by Agent View Post
    I'm honestly not sure if thats a wind up or being serious
    Its actually completely true

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    Re: lapping the cpu....

    rosaline and agent make the most sense to me with their explanations and reasoning. it is quite tricky to explain all the nuances and nothing seems as straightforward as it initially did!

    so basically flat without curvature is ideal
    then minimise the little ridges by using fine wet n dry (both surfaces)
    use the minimum of a good thermal compound

    its interesting to think how flat and how fine a grade of sanding grit would be required to not need thermal compound. I would imaging that would have to be factory level...but who knows?!

    has anyone tried using a burnisher? it's a rounded hard steel tool used in jewellery to polish stones, wood and the like and for other things i'm not too sure off. when using it on wood it slightly compresses to top fibres making it flat and hard. i was thinking it might be used on a lapped heat sink (i wouldnt want to put too much pressure on a cpu die) to flatten the ridges. though peterb states finer than '600 grit paper is unlikely to provide any worthwhile improvement'

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    Re: lapping the cpu....

    Here's a couple of youtubes for you all

    YouTube - This is Why We Lap by TheInformationator
    Clean Lapped cpu & heatsink sticking together

    YouTube - Big Typhoon Modification by TheInformationator
    Pay attention to the last few seconds of that one

  11. #41
    Senior Amoeba iranu's Avatar
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    Re: lapping the cpu....

    Quote Originally Posted by Pob255 View Post
    Here's a couple of youtubes for you all

    YouTube - This is Why We Lap by TheInformationator
    Clean Lapped cpu & heatsink sticking together

    YouTube - Big Typhoon Modification by TheInformationator
    Pay attention to the last few seconds of that one
    Great vids. I can tell you that lapping a Big Typhoon is a real pain. It's top heavy and has some nasty ridges above the copper base that dig into you as you grind. It takes time to get a good finish without putting bevels in or grinding it level. (There's a difference between level and flat - a surface can be flat but not level). I've also done the styrofoam down the sides and that does lower temps which is quite surprising.

    It is very important that when you apply thermal paste that you apply the minimum amount necessary. I've now decided that I am going to go the whole hog to a 1µ professional finish on my next build just because I can. I think I'll take some pics as well next year along with pre and post temps.
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  12. #42
    Senior Member Pob255's Avatar
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    Re: lapping the cpu....

    From the guid/thread he did How To: Extensively Modify Your Thermaltake Big Typhoon - Overclock.net - Overclocking.net
    He uses 1500 as the final grade then polishing cloth for a final shine and remove the scratches.

  13. #43
    The late but legendary peterb - Onward and Upward peterb's Avatar
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    Re: lapping the cpu....

    Quote Originally Posted by iranu View Post
    Great vids. I can tell you that lapping a Big Typhoon is a real pain. It's top heavy and has some nasty ridges above the copper base that dig into you as you grind. It takes time to get a good finish without putting bevels in or grinding it level. (There's a difference between level and flat - a surface can be flat but not level). I've also done the styrofoam down the sides and that does lower temps which is quite surprising.

    It is very important that when you apply thermal paste that you apply the minimum amount necessary. I've now decided that I am going to go the whole hog to a 1µ professional finish on my next build just because I can. I think I'll take some pics as well next year along with pre and post temps.
    It would be interesting with that finish to compare temps with and without thermal paste.
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