IBM's plans for new CPU Cooling...
Inbetween the heatspreader and the core itself...
What do you think?
Watercooling built into the CPU packaging itself! :eek:
http://www.smalltimes.com/Articles/A...ICLE_ID=275807
To get better heat transfer from the core -> heatspreader:
Quote:
A highly viscous paste is brought between the chip cap and the hot chip in order to reduce the thermal resistance. Thanks to its tree-like branched channels, the architecture allows the paste to spread very homogenously and attains a thickness of less than 10 micrometers. With this technique, two times less pressure is needed to apply the paste and a twofold increase in cooling performance can be achieved.
Also microscopic WC'ing:
Quote:
The researchers are also developing a novel and promising approach for water-cooling. Called direct jet impingement, it squirts water onto the back of the chip and sucks it off again in a closed system using an array of up to 50,000 tiny nozzles and a tree-like branched return architecture.
Quite groovy if it starts appearing on CPU's...
