Read more.“This milestone marks the tearing down of the memory wall”.
Read more.“This milestone marks the tearing down of the memory wall”.
*checks date*
Hmmm, fair enough then! Only problem I see is that they'll need to design a new memory controller that can handle the massive bandwidth on offer. It's all very well having a technical specification, but has anyone produced working silicon yet, even on a prototype scale?
EDIT: reading around it appears micron have produced demonstration silicon this year
Things might get quite odd as a result of this. TSVs are great but stacking die creates heat problems, both in terms of getting rid of it and the fact that the tsvs will expand at a different rate to the silicon.
Lower clock speeds but higher throughput is what we can expect.
Edit: yes Jim there have been a few things made in this way experimentally. Some homogeneous, some not.
Don't be surprised to see this equipped on the next-gen graphics cards.
Nvidia have already included this on their next gen Roadmap for approx 2016 release http://img.clubic.com/01C2000005791082-photo-nvidia-gpu-roadmap-2013.jpg
Next gen consoles are engaged in DDR5 technology (which devs are loving a lot) and I have to wonder if DDR4 will be used at all and can't wait to see DDR5 hit the streets for desktops.
There are currently 1 users browsing this thread. (0 members and 1 guests)