Read more.Info was shared at the recent Galaxy GOC 2017 Gaming gathering in China.
Read more.Info was shared at the recent Galaxy GOC 2017 Gaming gathering in China.
Wow, that was one error-laden report.
That final sentence is not corroborated by the previous - it says it will likely be fabbed on the same process node and use the same socket. What about architectural changes? Those would have to be really small for this to be a "Skylake-X refresh", and even if they are, that first statement does not provide the basis to state that as fact.Originally Posted by Hexus
Also, saying
is very odd. 300-series CPUs? There's no such thing. The roadmap clearly specifies "300-series chipsets" (my emphasis), which only tangentially relate to the launch of future CPU SKUs (although there's an important connection in business terms: no OEM will pay a premium for Z370 chipsets paired with some locked i5 or i3). Omitting the word "chipset" from the news post makes this confusing and just plain weird. It sounds like all of the CPUs in question will be in the i5-83XX range, which I assume they won't.Originally Posted by Hexus
And lastly:
To the first statement: This should be a surprise to noone. The roadmap doesn't point out any differentiators between generations of other product lines either - just TDPs, core counts and sockets (and chipsets for the tiered-launch mess that is KBL-S) - so why should the roadmap for Atom-series/N-series CPUs be different? As to the second: again, no. Pentium Gold are Core (KBL-S) architecture chips, not Atom. Pentium Silver is the designation for Atom-based Pentium chips. As I understood that rebranding, the whole point of it was to differentiate between Gold/Core/"best" and Silver/Atom/"worse". See AnandTech's report on that: link.Originally Posted by hexus
Didn't previous roadmaps have 8-core chips?
I think yes, but maybe they realized they do not need to push them out, yet. Why bother if your product line is still great, and these up coming variants are better performers anyway, without all the extra heat extra cores displace. When another die shrink occurs, then more cores will arrive.
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