Applying thermal paste

[mikeo01]

I usually use a pea drop in the middle, and press down on the heatsink and twist it side to side before clamping it down fully.

That way not only are you flatting it out evenly, but it will remove air bubbles

[Stasu]

Interestingly enough (for me at least), I've never came across the 'break-in' period before.

I don't think i'll be able to wait very long when my new graphics card turns up and I also open up my PC to overclock, but it's nice to know that any temperature readings will get better over the first 200 hours

[p5-]

Since the reintroduction of the IHS, I spread thermal paste all over as a blob in the middle doesn't ever seem to spread far enough!

[twenty4seven]

With direct heatpipe coolers, I'd pre-apply paste to the heatsink to fill the gaps between the ridges and then use the line method on the cpu. Either Akasa AK-455 or Artic Silver 5.

[ShadowKnight]

I normally use arctic silver but may give the noctua item a try.
I use a small blob, the spread it very thinly with a calling card or similar item, as too much will not help at all. I agree though that the gaps in the cooler should be filled though, as a processor needs all the help it can get not to get too flustered

In any case, the paste is more to fill gaps, as the surfaces are not fully even and would have air pockets, but should not be used like glue The integrated heatspreader help not to crack a core and to have a flatter surface though, which reduces the need for massive amounts of paste

[Mutley]

I used to use the thin spread method, I'd put a finger in the corner of a plastic bag and work a thin, smooth and even covering over the chip. With my last couple of systems though, I was expecting the CPU may not stay in place for long, so I went over to the blob of paste in the centre and plonking the cooler on top approach.

I've not noticed an appreciable advantage in terms of temperature with either technique so I now use the latter as it's a lot less time consuming/fiddly...

^^ what he said. And also what Saracen said.

Thinner is better - remember that you are not trying to create a layer between the heatsink and CPU, but improve head conductivity. The purpose of the paste is the fill in the microscopic 'troughs' in the connecting surfaces (you'll find these even in highly polished materials).

[blueball]

Arctics recommended methods:

http://www.arcticsilver.com/instructions.htm

[0iD]

To be honest over the years I've found no noticeable difference between using a spatula to spread it thin & even, or just smearing it on. If there is a good even pressure from the heatsink & the paste is fluid enough it will find its own level.

[bledd]

I always do a small x shape, then spread it out with a credit card. Never had any issues. I clean the stuff off with nail polish remover and tissue paper, then cotton buds

[mike306dt]

I use to spend ages with a stanley blade spreading it out smoothly, but now I just go for the pea sized blob in the middle and leave it work its own way out.

The only reason I went pea sized was that IC diamond is an absolute ....... to spread.