This question comes up repeatedly here and elsewhere. Common replies :
* Marketing names for process nodes are already fairly different to reality. Intel's 10nm process has various dimensions between 34-54nm
* Extreme Ultraviolet is supposed to kick the can down the road a bit longer - perhaps as low as 10-20nm 'half-pitch', regardless of what marketing call it. But it's been coming "real soon now" for 5-10 years.
* New materials (copper interconnects, or even carbon nanotubes?) might allow lower voltages, less leakage, less migration problems
* Below a real 10nm minimum feature size, quantum tunnelling problems are unavoidable. Might need a real alternative to silicon wafers.
By 2025 you could probably get a 16 core 4+GHz CPU in your mobile device, similar to Ryzen but with some nasty thermal throttling. Looks like dedicated "AI processors" are the next step, because we can't really think what to do with 16 ordinary cores in a mobile phone anyway, but could do with clever speech recognition and realtime image recognition.