I'm going to be replacing a Socket A motherboard but be keeping all of the other hardware. So I'm not sure if I can just slap the CPU and HSF across or if I'll have to clean the old compound off and re-apply some new stuff?
I'd always clean the old stuff off and apply new.
Look at the worest consequence down sides of each approach.
The downside of cleaning is that you have to go to all that trouble AND the cost of applying some new compound.
The down side of not cleaning could be poor thermal contact and a blown cpu.
Is cleaning really that much of a chore ?
Id agree with billythewiz, new compund cant hurt it and compound dont cost much
Aye, change it. Only time I would say otherwise is if the CPU accidently comes out of the socket while stuck to the heatsink... (and yes that has happened to me a couple of times with P4's)
For socket A chips Id always clean everything up with something like acetone or akasa tim cleaner and re-apply new thermal past. It's just not worth the risk!
There are currently 1 users browsing this thread. (0 members and 1 guests)