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About LinkBacksRead more.12x12x1mm designs leverage Intel's Foveros 3D-stacking tech and intro mixed CPU cores.
Read more.12x12x1mm designs leverage Intel's Foveros 3D-stacking tech and intro mixed CPU cores.
So with 3D stacking, how do they cool it?
The same way the bottom of the silicon gets cooled now - its heat dissipates upwards through the rest of the chip. Silicon is by no means a perfect thermal insulator: if it was all our CPUs would burn through their substrates as soon as you turned them on...Originally Posted by chj
Probably created to allow them to dramatically fudge figures. It seems the only way they cab come close to AMD in the foreseeable future.
Fair enough, I just thought the increase in thickness might make it harder to cool. I guess they wouldn't of gotten past the R&D stage if it was too much of a concern.
wasn't it leaked months ago? I guess with one of these
That may be why it's been delayed by a year. Intel's 10nm troubles are ongoing.
Scaling Foveros up to desktop levels of power may be impossible.
the easiest way would be to cool from bottom as well maybe a ceramic socket with heat pipes
What does it matter now if men believe or no?
What is to come will come. And soon you too will stand aside,
To murmur in pity that my words were true
(Cassandra, in Agamemnon by Aeschylus)
To see the wizard one must look behind the curtain ....
At the power levels available in target devices (i.e. where you'd normally find a phone chip), who cares about cooling?
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