Read more.It uses custom machinery to inject and brush precise amounts, plus a sponge fence.
Read more.It uses custom machinery to inject and brush precise amounts, plus a sponge fence.
I had to do a double take:
https://en.wikipedia.org/wiki/Liquidmetal
They are talking abut liquid metal thermal compound,not liquidmetal alloy which was used in various applications such as USB flash drives years ago.
"Last week Intel launched its 10th Gen Core H-series CPUs for gaming and creator laptops"
Are Creator laptops a middle brand between laptops and workstations, or is the term another Marketing ploy to sell the exact same laptops with nothing different included?
Bit of both but mostly a marketing ploy....at least in the Nvidia side of things.
Geforce cards now have 2 driver choices, one is 'optimised' for content creation, ie adobe etc, the other is more games focused.... in all honesty not a lot of difference and no idea why they couldn't just bundle it together. Not to mention people have been using 'quadro' drivers on geforce cards for years too, there's that little difference lol.
There is a little crossover with 'workstations' where they have quadro cards but in most cases it's a geforce based rig with 'creator ready' drivers.
Good, they finally starting to put descent thermal compound
Imagine what will happen when they do it with a CPU manufactured using technology invented AFTER 2015!
For my upgrade to a 3900X I had a choice of liquid metal or one of those conducting pad things (I had both available). I went for the pad on the grounds that I was going to potentially have to swap liquid coolers as my AIO was being transferred from an Intel system to an AM4 system and AM4 was not a thing when the brackets were invented. Bodging was required and so there was a good chance I'd have to redo the lot with a new cooler.
It's 25C in this room and I'm hitting around 35C (34C-36C) on tickover as well as maxing out at ~75-76C at full load. I think those are damned fine temperatures for an old AIO and a thermal pad which took about 20 seconds to install.
I did consider using the liquid metal on the CPU as well as the pad but decided I'd hold it in reserve for if the temperatures were poor given the risk involved, the cost of the components and my inexperience. I'd say that the pad alone was more than acceptable.
I have liquid metal between my TR and Heatkiller IV, been there a year now, i am dreading installing hardware in new home i will have to lap the cooler.
Think i will use something conventional when i redo the system and add H2O to the GFX too.
Dont even know what alternatives there is, just picked the liquid metal when i put the new system together last year in its temporary home.
Will have to read up on this for sure, about a decade ago since i last studied options for cooling paste.
Been using liquid metal for over 10 years now. Never had any issues with it. The only real downside is that it eats itself into the surface.
Even without changing the paste, that thing flies compared to my under-powered Surface Pro 4 i7 - which often gets hot & bothered doing virtually nothing.
Looking forward to the Ryzen 4800H & 4900H making it into a broader range of devices and form-factors - especially hoping for something a bit like an over-sized Surface Pro to come to market.
Liquid medtal, it's the natural progression from "liwing tissue ofer medal endoskeledon". Just ask Sarah Connor.
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