Just a quick question guys....
This only came about recently after I repaired an Xbox 360 from RROD.
When I put a system together I always put a "blob" of thermal paste on the cpu, but a few people I know have said that they spread it over before putting the heatsink down. Now I've always had decent results from the "blob" method, but others have been championing the "spread" method.
Has anyone tried both, if so what method gave the better results?
As I was always told you should put a "blob" on and let the heatsink spread it to avoid any air getting trapped.
Any thoughts on either method guys?
Cheers.
Tom.