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Thread: IDF Spring 04: Day 2: Keynote

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    DR
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    IDF Spring 04: Day 2: Keynote

    Intel demonstrated the BTX 12.9 and 6.9 solutions – Grantsdale and Alderoowd – high performance in a small form factor; we believe that Intel has done this since they have seen the success of the Shuttle XPC solutions and the like. The idea of the BTX solution is that by reducing the size of the main board, and re-designing the airflow out of the vents they can get higher performance cooling in a smaller package.
    http://www.hexus.net/content/reviews...lld19JRD03MTE=

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    is it me or are all these new chip names and future chip names confusing as hell...

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    DR
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    Yep... you are spot on there, Intel need to work out a nicer naming convention. I think the biggest thing is that they have so many products it is hard to do it.

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    about the btx form factor.. i really question how much of an improvement that it will give to the shuttle size computers.. esp since the new chips are going to be running hotter. doesnt ddr2 run hotter as well? also if i am getting this correctly, it seems stupid to have that pci slot on the picbtx as detachable..total differ is maybe an inch.. and chances are that you are going to add sth there...i mean was it designed like that so that people can build smaller boxes? that would just lead to more confusion right there when u buy a case for it...

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