This may interest some people:
http://www.youtube.com/watch?v=EyXLu1Ms-q4
This may interest some people:
http://www.youtube.com/watch?v=EyXLu1Ms-q4
chuckskull (09-01-2011),duc (09-01-2011),Iron Sights (09-01-2011),MaddAussie (11-01-2011),Uriel (09-01-2011),vinnyT (15-01-2011)
Haha I can't believe I just watched that with interest
Awesome. I've tended to spread after getting poor results using AS5 with pea/rice methods.
I use MX-2 now. Maybe I'll go back to pea.
Dotting it would seem best. Although the air trapped with the spread method would soon be squeezed out no?
The cross method looked really effective!
They should have tried a diagonal line (half the cross) and see if that did much
As long as you apply it sensibly i don't think you can go too wrong.
Kalniel: "Nice review Tarinder - would it be possible to get a picture of the case when the components are installed (with the side off obviously)?"
CAT-THE-FIFTH: "The Antec 300 is a case which has an understated and clean appearance which many people like. Not everyone is into e-peen looking computers which look like a cross between the imagination of a hyperactive 10 year old and a Frog."
TKPeters: "Off to AVForum better Deal - £20+Vat for Free Shipping @ Scan"
for all intents it seems to be the same card minus some gays name on it and a shielded cover ? with OEM added to it - GoNz0.
Always done the 'spread' method myself.
Are airbubbles bad?
rice grain for many years now
I used to spread a thin layer on the CPU but, For the last few years have dotted the centre. Never bothered with 'tinting' and run reasonable temps. 36c at 100% load.
Also slightly off topic, but which compound do you guys/girls prefer?
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