Originally Posted by
Saracen
Erm .... I'm no Intel engineer, but that isn't quite how i understood it.
Yes, the case sensor is on the chip itself. But it gives an analog reading. The AD conversion, which gives the results that will be displayed in BIOS or by monitoring software, takes place on the motherboard.
So yes, the CPU provides the sensor, and thus will perform in the same way (though not necessarily give identical readings if external factors have changed, such as a different mobo giving a slightly different mounting location which results is chassis airflow differences affecting the hsf to ambient temp differential), but the results reported will vary if the motherboard calibration or AD conversion is different.
We agree entirely on the implications, aidan, but unless I'm mistaken in the above, the second half of your quoted statement (about the 1000 mobo's) isn't necessarily the case. In fact, it's that variation in ADS conversion and calibration that is part of the reason why user temp results aren't an accurate way of assessing if a chip is in-spec or not. As I understand it. I do, of course, stand to be corrected if anyone knows better.
Note : In the above, I'm referring to Tcase, not Tjunction, for which the process is different, but the oft-quoted 71c refers to Tcase not Tjunction.